ROHM’s PM<span style='color:red'>IC</span>s for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
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ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.
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Release time：2024-12-20 13:56 reading：299 Continue reading>>
SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications
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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.
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Release time：2024-12-19 10:34 reading：202 Continue reading>>
GigaDevice GD25/55 Serial NOR Flash Automotive-Grade Product Family Certified for ISO 26262 ASIL D
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GigaDevice GD25/55 Serial NOR Flash Automotive-Grade Product Family Certified for ISO 26262 ASIL D

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announced its GD25/55 SPI NOR Flash Automotive-Grade Product Family has received ISO 26262:2018 ASIL D Automotive Functional Safety certification from SGS, the world's leading Testing, Inspection and Certification company. This achievement not only strongly validates the outstanding safety performance and reliability of the GD25/55 SPI NOR Flash product in demanding automotive applications but also further solidifies the company's leadership position in the SPI NOR Flash field.　　With the exponential growth in the number of automotive electronics and electrical components, the demand for safety is becoming increasingly critical. As the internationally recognized standard for automotive functional safety, ISO 26262 aims to reduce the risks associated with automotive electronics and electrical systems and ensure the safety performance of vehicles. Under the ISO 26262 framework, the ASIL (Automotive Safety Integrity Level) classification system divides functional safety into four levels, ranging from A (lowest) to D (highest). Level D represents the highest level of safety, meaning that development processes at this level are subject to the most stringent requirements.　　GigaDevice has always maintained a focus on precision and excellence in the automotive electronics field, with product quality at the core of its business development. In terms of quality management, the company’s automotive-grade Flash aims for a 0 PPM defect rate, continuously driving quality improvements and earning widespread trust from customers. To date, global shipments have surpassed 200 million units. In terms of functional safety, GigaDevice has strengthened its process systems and personnel management, continuously enhancing its functional safety management capabilities. After achieving ISO 26262 ASIL D process certification in 2023, the company’s automotive-grade SPI NOR Flash has now also received ASIL D functional safety certification. This demonstrates that GigaDevice has established a rigorous development process for automotive-grade chips, and based on this foundation, has developed the mature capability to design products that meet functional safety standards.　　The GD25/55 SPI NOR Flash Automotive-Grade Product Family strictly adheres to the AEC-Q100 Grade 1 standard and is manufactured using 55nm/45nm process technology. It supports operating voltages of 3V, 1.8V, and a range from 1.65V to 3.6V, with capacities ranging from 2Mb to 2Gb, fully meeting the code storage requirements of automotive electronics. In terms of read/write performance, it offers single-channel, dual-channel, quad-channel, and octal-channel communication modes, with data throughput rates of up to 400MB/s, ensuring efficient data transmission. The product also boasts 100,000 erase/write cycles and a data retention period of up to 20 years. For enhanced safety, products with capacities of 64Mb and above feature built-in ECC algorithms and CRC check functions, improving reliability and extending the product's lifespan.　　Currently, GD25/55 SPI NOR Flash Automotive-Grade Product Family are widely used by numerous domestic and international automakers and Tier 1 suppliers, serving key automotive electronics applications across a range of fields including In-Vehicle Infotainment, Intelligent Cockpits, Connected Car Systems, Advanced Driver Assistance Systems (ADAS), Autonomous Driving, Battery Management System, Domain Controllers, Central Computing, Central Gateways, and Zone Control Systems.　　Ruwei Su, GigaDevice Vice President and General Manager of Flash BU, stated: “As a critical medium for storing key code in automotive electronics, the functional safety of NOR Flash is essential to ensure the reliability and integrity of data in extreme environments, directly impacting the safety and stable operation of vehicles. GigaDevice GD25/55 SPI NOR Flash Automotive-Grade Product Family has obtained the ISO 26262:2018 ASIL D automotive functional safety certification, which fully demonstrates the company's strong capabilities in automotive-grade chip design. Moving forward, GigaDevice will continue to uphold high standards of automotive functional safety, strictly adhere to relevant process specifications, and provide global customers with more high-quality, highly reliable automotive-grade storage products.”
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Release time：2024-12-17 16:03 reading：254 Continue reading>>
NOVOSENSE's NCA1044-Q1 CAN Transceiver Successfully Passes the IBEE/FTZ-Zwickau EMC Certification
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NOVOSENSE's NCA1044-Q1 CAN Transceiver Successfully Passes the IBEE/FTZ-Zwickau EMC Certification

　　NOVOSENSE announced that its newly launched NCA1044-Q1, an automotive-grade CAN transceiver, had received the EMC certification test reports from IBEE/FTZ-Zwickau, a prestigious European testing organization. NCA1044-Q1 successfully passed all test items. NOVOSENSE now can provide the test report to support automakers in streamlining their system certification process and accelerating their product launches.　　CAN transceivers are commonly used in automotive CAN bus networks typically for critical control and diagnostics functions, such as battery, motor control, electronic control, braking, steering, and airbag systems. These applications are prone to various sources of electromagnetic interference (EMI), including battery, motor and electronic control systems for EVs, engine, frequency converter and wireless communication devices. Such disturbances can adversely affect data transmission, leading to signal errors or system failures, and even compromised system safety.　　In addition, due to the long distance of CAN bus wiring in automotive systems, CAN transceivers can easily radiate noise through the CAN bus acting as an antenna. This can result in radiated emission and conducted emission from modules or the entire system that exceed the requirements for vehicle. Therefore, CAN transceivers that provide good electromagnetic compatibility (EMC) performance are essential for ensuring system reliability.　　Full compliance with IBEE/FTZ-Zwickau certification　　Given the critical role of CAN transceiver's EMC performance in automotive safety, countries or regions have established stringent automotive EMC standards and certification procedures for automakers to follow. For example, both the SAE J2962 standard and the European IBEE/FTZ-Zwickau certification set clear requirements for the EMC performance of automotive electronics.　　The IBEE/FTZ-Zwickau certification is carried out according to the IEC 62228-3 standard. Compared with SAE J2962, IEC 62228-3 excludes the effects of peripheral circuits, focuses more on the EMC property of the CAN transceiver itself, and specifies higher performance level requirements. The IEC 62228-3 standard is also extensively adopted by automakers outside of Europe. The IBEE/FTZ-Zwickau certification includes four tests: Emission RF Disturbances, Immunity RF Disturbances, Immunity Transients, and Immunity ESD. NCA1044-Q1 from NOVOSENSE successfully passed all four tests.　　Industry-leading interference immunity　　NCA1044-Q1 features an ingenious circuit design that addresses the issue of output signal errors caused by abnormal high-voltage interference affecting its output circuit. This enhances its EMC performance, helping customers substantially reduce their EMC design complexity, simplify peripheral components, and lower costs.　　Furthermore, NCA1044-Q1 boasts industry-leading interference immunity. According to IEC 62228-3, when external RF noise at different frequency bands couples to the CAN bus, a higher pass-through power indicates stronger interference immunity. This means a lower risk of errors in the system.　　Even without the use of a common-mode inductor filter on the bus, NCA1044-Q1 from NOVOSENSE can still meet the highest power requirements specified in the standard (as shown in Figure-1 and Table-2). Although this test is typically not required at the application level, NCA1044-Q1 still successfully passed the test. This capability helps users reduce peripheral circuits, lower costs, and enhance system robustness.　　Packages and selection　　NCA1044-Q1 is now in mass production and is available in SOP8 and DFN8 packages. Compliant with the AEC-Q100 Grade 1 requirements, it operates in a wide temperature range from -40°C to 125°C, and provides over-temperature protection. NCA1044-Q1 also supports TXD dominant timeout function and remote wake-up in standby mode. 
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Release time：2024-12-16 17:06 reading：373 Continue reading>>
Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
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Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RZ/T2H, the highest performance microprocessor (MPU) offered by Renesas for industrial equipment. Thanks to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision control of industrial robot motors for up to 9 axes. It supports a variety of network communications including Industrial Ethernet on a single chip. The MPU targets industrial controller equipment such as programmable logic controllers (PLCs), motion controllers, distributed control systems (DCSs), and computerized numerical controls (CNCs).　　With the growing demand for unmanned and labor-saving manufacturing, industrial robots such as vertically articulated robots, and industrial controller equipment are being deployed to accelerate automated production. The Renesas RZ/T2H MPU combines all the functionality and performance required for developing these applications. While industrial systems traditionally required multiple MPUs or a combination of field programmable gate arrays (FPGAs) to control these applications, the RZ/T2H MPU can now meet all the requirements on a single chip. This reduces the number of components and saves time and costs of FPGA program development.　　“We have enjoyed outstanding market success with RZ/T2M and RZ/T2L,” said Daryl Khoo, Vice President of Embedded Processing 1st Business Division at Renesas. “The RZ/T2H builds on that momentum, allowing our industrial customers to leverage their existing design assets while addressing even more innovative, demanding industrial motor control and Linux applications. Our customers have been particularly impressed that the RZ/T2H enables them to implement a 9-axis motor control all on just one chip!”　　High-Performance Application Processing and Fast Real-Time Control on a Single Chip　　The RZ/T2H is equipped with four Arm® Cortex®-A55 application CPUs with a maximum operating frequency of 1.2 GHz. For external memory, it supports 32-bit LPDDR4-3200 SDRAM. Two Cortex-R52 CPUs with a maximum operating frequency of 1 GHz handle the real-time processing, with each core equipped with a total of 576 KB of high-capacity tightly coupled memory (TCM). This allows high CPU- and memory-intensive tasks such as running Linux applications, robot trajectory generation, and PLC sequence processing, to be executed on a single chip. At the same time, the RZ/T2H can handle fast and precise real-time control such as motor control and Industrial Ethernet protocol processing.　　Motor control of up to 9 axes reduces component costs and development time　　The Renesas RZ/T2H controls up to 9-axis servo motors in industrial robots with high-speed and accurate operation. The RZ/T2H comes with everything required for up to 9 axes of motor control including 3-phase PWM timers, delta-sigma interfaces for measuring current values, and encoder interfaces (A-format™, EnDat, BiSS®, Hyperface DSL, and FA-CODER are all supported). Furthermore, peripheral functions for motor control are placed on a Low Latency Peripheral Port (LLPP) bus of the Cortex-R52 real-time CPU core, allowing high-speed access from the CPU.　　Flexible support for network communications including Industrial Ethernet　　The RZ/T2H has four Ethernet ports, three Gigabit Ethernet MAC (GMAC), plus an Ethernet switch. It also supports EtherCAT, PROFINET, EtherNet/IP, OPC UA, and the next-generation Time-Sensitive Networking (TSN) standard. The combination of these Ethernet switches and GMAC allows the MPU to support multiple Industrial Ethernet controllers and devices, providing flexibility to adapt to a wide range of controller requirements, such as upper-layer Ethernet communications.　　Specialized boards and software available for industrial robots and controllers　　The RZ/T2H comes with the Renesas Flexible Software Package (FSP), as with all Renesas MPUs, together with a Linux package that comes with long term support. An out-of-the-box multi-axis motor control evaluation solution is available including inverter boards for driving 9-axis motors, a multi-axis motor control software package, and Motion Utility Tool (a motor control software tool). Sample protocols for industrial Ethernet and software PLC package are also included to kick-start system development.　　“As industrial equipment continues to evolve, these systems increasingly require more complex functions and performance,” said Micael Borgefeldt, Product Manager at IAR Systems. “Including the latest RZ/T2H MPU from Renesas, we empower the developers to unlock flexible application configurations across 32-bit MCUs and 64-bit high-end MPUs multi-core environments. Our IAR development solution enables engineers to accelerate next-generation industrial innovation, streamlining development and boosting efficiency like never before.”　　Winning Combinations　　Renesas also offers “9-axis Industrial Motor Control with Ethernet” solution that combined the RZ/T2H with numerous compatible devices such as the RV1S9231A IGBT Drive Photocoupler and RV1S9353A Optically Isolated Delta-Sigma Modulator to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio: renesas.com/win.　　Availability　　The RZ/T2H is available today. Renesas plans to release the new RZ/N2H device in Q1/2025, which offers the same performance as the RZ/T2H in a smaller package. This is ideal for industrial controller equipment such as PLCs and motion controllers.　　The RZ/T2H is managed under the Product Longevity Program (PLP) for industrial equipment that requires long life cycles. For more information on the RZ/T2H, visit: https://www.renesas.com/rzt2h.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Arm and Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. All names of products and services mentioned in this release are trademarks or registered trademarks of their respective owners.
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Release time：2024-12-02 14:31 reading：542 Continue reading>>
Valeo & ROHM Semiconductor co-develop the next generation of power electronics
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Valeo & ROHM Semiconductor co-develop the next generation of power electronics

　　Valeo, a leading automotive technology company, and ROHM Semiconductor, a major semiconductor and electronic component manufacturer, collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack™ to Valeo for future powertrain solutions.　　Valeo is broadening access to efficient, electrified mobility across various vehicle types and markets from the smallest one (ebikes), through the mainstream (passenger cars) to the biggest one (eTrucks). By combining Valeo’s expertise in mechatronics, thermal management and software development with ROHM’s power modules, Valeo drives the power electronics solution forward, contributing to the performance, efficiency, and decarbonization of automotive systems worldwide.　　Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchanges aimed at improving the performance and efficiency of the motor inverter – a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs). By refining power electronics, both companies aim to offer optimized cost/performance by delivering higher energy efficiency, reducing heat generation thanks to an optimized cooling and mechatronic integration, and increasing overall reliability with a SiC packaging.　　“This partnership marks, for Valeo Power Division, a significant step forward in delivering advanced and high-efficient power electronics,” says Xavier DUPONT, Valeo Power Division CEO. “Together, we aim to set new industry standards for high voltage inverters and accelerate the transition towards more efficient and affordable electric mobility.”　　“We are pleased to support Valeo, a renowned automotive supplier, with our power semiconductors. ROHM’s TRCDRIVE pack™ provides high power density, leading to an improved power efficiency. Together, we contribute to the development of highly efficient powertrains by fostering the collaboration with Valeo,” says Wolfram HARNACK, President ROHM Semiconductor GmbH.　　These evolutions are all essential to supporting the growing demand for longer range, faster charging capabilities, and, overall a high-performance and an affordable inverter for BEVs and PHEVs.　　Valeo will start supplying a first series project in early 2026. Valeo and ROHM will contribute to the improvement of efficiency and downsizing of Valeo’s next generation of xEV inverters.　　Background on the TRCDRIVE pack™　　TRCDRIVE pack™ is a trademark for the SiC molded module developed for traction inverter drives. This product features high power density and a unique terminal configuration – solving the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. Because SiC enables low-loss power conversion under high voltage conditions, combining Valeo's component technology, casing design and thermal management expertise with ROHM's power module creates a synergistic effect. Through both companies’ collaboration in automotive power electronics, they contribute to achieving a decarbonized society by enhancing the performance and efficiency of the motor inverter.　　More information is available via:　　https://www.rohm.com/news-detail?news-title=2024-06-11_news_trcdrive-pack&defaultGroupId=false　　TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.　　About Valeo　　Valeo is a technology company and partner to all automakers and new mobility players worldwide. Valeo innovates to make mobility safer, smarter and more sustainable. Valeo enjoys technological and industrial leadership in electrification, driving assistance systems, reinvention of the interior experience and lighting everywhere. These four areas, vital to the transformation of mobility, are the Group's growth drivers.　　Valeo in figures: 22 billion euros in sales in 2023 | 109 600 employees, 28 countries, 159 plants, 64 research and development centers and 19 distribution platforms at June 30, 2024.　　https://www.valeo.com/　　Valeo is listed on the Paris stock Exchange.
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Release time：2024-11-29 10:49 reading：200 Continue reading>>
ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance
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ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance

　　ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models - SCS2xxxNHR - for automotive applications such as onboard chargers (OBCs), with plans to deploy eight models - SCS2xxxN - for industrial equipment such as FA devices and PV inverters in December 2024.　　The rapidly expanding xEV market is driving the demand for power semiconductors, among them SiC SBDs, that provide low heat generation along with high-speed switching and high-voltage capabilities in applications such as onboard chargers. Additionally, manufacturers increasingly rely on compact surface mount devices (SMDs) compatible with automated assembly equipment to boost manufacturing efficiency. Compact SMDs tend to typically feature smaller creepage distances, fact that makes high-voltage tracking prevention a critical design challenge.　　As leading SiC supplier, ROHM has been working to develop high-performance SiC SBDs that offer breakdown voltages suitable for high-voltage applications with ease of mounting. Adopting an optimized package shape, it achieves a minimum creepage distance of 5.1mm, improving insulation performance when contrasted with standard products.　　The new products utilize an original design that removes the center pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, approx. 1.3 times greater than standard products. This minimizes the possibility of tracking (creepage discharge) between terminals, eliminating the need for insulation treatment through resin potting when surface mounting the device on circuit boards in high voltage applications. Additionally, the devices can be mounted on the same land pattern as standard and conventional TO-263 package products, allowing an easy replacement on existing circuit boards.　　Two voltage ratings are offered, 650V and 1200V, supporting 400V systems commonly used in xEVs as well as higher voltage systems expected to gain wider adoption in the future. The automotive-grade SCS2xxxNHR are AEC-Q101 qualified, ensuring they meet the high reliability standards this application sector demands.　　Going forward, ROHM will continue to develop high-voltage SBDs using SiC, contributing to low energy consumption and high efficiency requirements in automotive and industrial equipment by providing optimal power devices that meet market needs.　　Application Examples◇ Automotive applications: Onboard chargers (OBCs), DC-DC converters, etc.　　◇ Industrial Equipment: AC servo motors for industrial robots, PV inverters, power conditioners, uninterruptible power supplies (UPS), and more　　Online Sales InformationAvailability: The SCS2xxxxNHR for automotive applications are available now.　　The SCS2xxxN for industrial equipment are scheduled in December 2024.　　Pricing: $10.50/unit (samples, excluding tax)　　Online Distributors: DigiKey™, Mouser™ and Farnell™　　The products will be offered at other online distributors as they become available.　　EcoSiC™ BrandEcoSiC™ is a brand of devices that leverage silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　TerminologyCreepage Distance　　The shortest distance between two conductive elements (terminals) along the surface of the device package. In semiconductor design, insulation measures with such creepage and clearance distances must be taken to prevent electric shocks, leakage currents, and short-circuits in semiconductor products.　　Tracking (Creepage Discharge)　　A phenomenon where discharge occurs along the surface of the package (insulator) when high voltage is applied to the conductive terminals. This can create an unintended conductive path between patterns, potentially leading to dielectric breakdown of the device. Package miniaturization increases the risk of tracking by reducing creepage distance.　　Resin Potting　　The process of encapsulating the device body and the electrode connections between the device and circuit with resin, such as epoxy, to provide electrical insulation. This provides durability and weather resistance by protecting against water, dust, and other environmental conditions.　　AEC-Q101 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q101 is a standard that specifically applies to discrete semiconductor products (i.e. transistors, diodes).
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Release time：2024-11-20 14:00 reading：277 Continue reading>>
GigaDevice GD32F30x Software Test Library (STL) Achieves TÜV Rheinland IEC 61508 Functional Safety Certification
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GigaDevice GD32F30x Software Test Library (STL) Achieves TÜV Rheinland IEC 61508 Functional Safety Certification

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, and Power Management technologies announced that its GD32F30x Software Test Library (STL) has received IEC 61508 SC3 (SIL 2/SIL 3) functional safety certification from TÜV Rheinland. This certification follows the earlier certification of the GD32H7 Software Test Library (STL), demonstrating that GigaDevice has established a comprehensive presence in the field of functional safety. The company now offers software test libraries for both high-performance Arm® Cortex®-M7 core MCUs and mainstream Arm® Cortex®-M4 core MCUs, providing users with a broader range of product options for industrial applications. These achievements highlight GigaDevice’s commitment to product safety and reliability, as well as its expertise and advancements in the field of functional safety.　　The GD32F30x STL software test library is designed to ensure the safe operation of the GD32F30x series MCUs. It monitors the status of core units such as the internal CPU/DPU, FPU, and MPU, and conducts regular checks on memory like SRAM and Flash to quickly identify random hardware faults. Upon detecting a fault, the GD32F30x Software Test Library (STL) immediately triggers a preset safety response mechanism, placing the MCU in a safe state, thereby mitigating potential risks and providing users with time to address and rectify system failures. Additionally, it offers comprehensive documentation, including FMEDA and safety manuals, to ensure that the product meets specific safety requirements throughout the design, development, and production processes.　　Vincent Li, GigaDevice CTO and General Manager of MCU BU, stated: "As industrial automation and intelligence continue to evolve, the importance of functional safety becomes increasingly evident. The consecutive IEC 61508 SC3 (SIL 2/SIL 3) functional safety certifications for the GD32H7 STL and GD32F30x STL demonstrate that GigaDevice has established a mature management system in the functional safety field. This is crucial for enhancing the overall competitiveness of our GD32 MCU products and enabling users to develop products that meet functional safety standards in a shorter timeframe. Meanwhile, the certification process for the GD32 MCU software test library based on the Arm® Cortex® M33 core is also progressing concurrently. We will continue to align with international standards and drive technological advancements and product upgrades.”　　Bin Zhao, General Manager Cybersecurity & Functional Safety Greater China of TÜV Rheinland stated: Congratulations to GigaDevice for once again obtaining TÜV Rheinland's STL functional safety certification! GigaDevice's steadfast commitment to functional safety reflects its dedication to stringent safety standards, which we highly commend. In the future, we will continue to uphold professional technical requirements, adhere to rigorous certification processes, and deepen our collaboration to support GigaDevice in achieving further breakthroughs in the field of functional safety.”　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety production certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.
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Release time：2024-11-07 14:00 reading：518 Continue reading>>
ROHM at electronica 2024: Empowering Growth, Inspiring Innovation
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ROHM at electronica 2024: Empowering Growth, Inspiring Innovation

　　Willich/Munich, Germany, October 10th, 2024 – ROHM Semiconductor Europe is looking forward to electronica 2024 – the world’s leading trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between November 12th to 15th in Munich.　　At booth C3-520, ROHM will showcase its advanced power and analog technologies designed to enhance power density, efficiency, and reliability in both automotive and industrial applications. These advancements are crucial for addressing the increasing demands of modern electronic systems, particularly in the context of sustainability and innovation.　　Under the theme "Empowering Growth, Inspiring Innovation," ROHM will highlight via its various demo application stations in “tree style” how its high-quality semiconductor technologies contribute to solving critical social and ecological challenges. The focus will be on driving sustainability in electronic design and innovation, which aligns with the growing emphasis on creating environmentally responsible solutions within the industry.　　At electronica 2024, the exhibition space has been greatly expanded and the number of items on display has been increased to 30 – more than three times compared to the previous show.　　The latest solutions will be exhibited under the three themes of “for E-Mobility”, “for Automotive”, and “for Industrial”.　　For E-Mobility　　・TRCDRIVE pack™ with 2-in-1 SiC Molded Module to improve the efficiency of traction inverters　　・New EcoIGBT™ products for electric compressors　　・New EcoSiC™ Schottky Barrier Diodes for onboard chargers　　For Automotive　　・New configurable PMIC with supporting functional safety features for application processors, SoCs and FPGAs　　・LED Driver ICs for Exterior Lighting / Head Lamps　　・Advanced solutions on the ADAS cockpit demo　　For Industrial Equipment　　・Industrial AC-DC PWM Controller ICs – support a wide range of power transistors from Si MOSFETs and IGBTs to SiC MOSFETs　　・The EcoGaN™ family of 150V and 650V class GaN HEMTs in several EVKs　　・Latest R&D project on Terahertz　　In addition to product showcases, ROHM is committed to fostering technical exchange and collaboration at electronica 2024. "For us, electronica is more than just a showcase – it’s an opportunity to forge new connections, strengthen existing partnerships, and reunite with industry peers," says Wolfram Harnack, President of ROHM Semiconductor Europe. "We are excited to welcome our guests to Munich as we work together to shape the future of electronics."　　For a sneak peek at which highlights ROHM will present during electronica 2024, visit our event preview page: https://www.rohm.com/electronica　　TRCDRIVE pack™, EcoIGBT™, EcoSiC™ and EcoGaN™ are trademarks or registered trademarks of ROHM Co., Ltd.
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Release time：2024-11-05 15:56 reading：395 Continue reading>>
Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.
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Release time：2024-10-15 13:19 reading：370 Continue reading>>

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